Effect of plasma power on growth process, chemical structure, and properties of PECVD films produced from hexamethyldisilane and ammonia

Effect of plasma power on growth process, chemical structure, and properties of PECVD films produced from hexamethyldisilane and ammonia Full article

Journal

Surface & Coatings Technology
ISSN: 1879-3347 , E-ISSN: 0257-8972

Output data

Year: 2024, Volume: 490, Article number : 131131, Pages count : 12 DOI: 10.1016/j.surfcoat.2024.131131

Tags

Silicon, Cu diffusion barrier, Thin film, Porosity, SiCN

Authors

Ermakova Evgeniya ¹ , Shayapov Vladimir ¹ , Saraev Andrey ² , Maximovsky Eugene ¹ , Kirienko Viktor ³ , Khomyakov Maksim ⁴ , Sulyaeva Veronica ¹ , Kolodin Aleksey ⁵ , Gerasimov Evgeny ² , Kosinova Marina ¹

Affiliations

1	Department of functional materials, Nikolaev Institute of Inorganic Chemistry SB RAS, Novosibirsk 630090, Russia
2	Boreskov Institute of Catalysis SB RAS
3	Rzhanov Institute of Semiconductor Physics SB RAS
4	Institute of Laser Physics SB RAS
5	Department of Chemistry of Coordination, Cluster and Supramolecular Compounds, Nikolaev Institute of Inorganic Chemistry SB RAS, Novosibirsk 630090, Russia

Silicon carbonitride films were grown by plasma enhanced chemical vapor deposition (PECVD) using hexamethyldisilane (HMDS) and ammonia initial gas mixture at deposition temperature of 300 °C. The elemental composition, growth rate, hardness, dielectric constant, and refractive index values of the SiCN:H thin films were analyzed as function of plasma power ranging from 10 to 80 W. In-situ analysis of gas phase performed by optical emission spectroscopy (OES) revealed the presence of H2, H, CH, and CN particles. Concentration trends of H and CH particles under plasma power variation were determined using an actinometry technique. Fourier-transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), energy-dispersive X-ray analysis (EDX) confirmed the effective incorporation of nitrogen at the level of 20 at.% through formation of Sisingle bondN, Nsingle bondH, and Csingle bondN bonds. The ratios of Si/C and Si/N, and surrounding of Si, C, and N atoms analyzed by XPS did not change with rise of plasma power, while the hydrogen content in films, mainly involved in CHx fragments, decreased. The films with hardness of 5.0–8.1 GPa, refractive index of 1.64–1.76, and dielectric constant of 4.1–5.1 were synthesized by varying the experimental conditions. The ellipsometric porosimetry (EP) shows the absence of a porous structure. Analysis of annealed Cu/SiCN:H/Si(100) structure by transmission electron microscopy (TEM) showed clear interfaces of SiCN:H with both the Cu layer and the Si(100) substrate. No noticeable diffusion of copper through dielectric layer was detected. The aging of films during storage under environmental conditions was studied. It was shown that the most stable film was obtained using 80 W plasma power, and had a composition of Si0.3C0.5N0.2:H.

Ermakova E. , Shayapov V. , Saraev A. , Maximovsky E. , Kirienko V. , Khomyakov M. , Sulyaeva V. , Kolodin A. , Gerasimov E. , Kosinova M.
Effect of plasma power on growth process, chemical structure, and properties of PECVD films produced from hexamethyldisilane and ammonia
Surface & Coatings Technology. 2024. V.490. 131131 :1-12. DOI: 10.1016/j.surfcoat.2024.131131 WOS Scopus РИНЦ OpenAlex

Submitted:	Mar 5, 2024
Accepted:	Jul 12, 2024
Published online:	Jul 14, 2024
Published print:	Aug 30, 2024

Web of science:	WOS:001283571800001
Scopus:	2-s2.0-85199422782
Elibrary:	68376658
OpenAlex:	W4400616981

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